Title :
Mixed-signal system-on-chip verification using a recursively-verifying-modeling (RVM) methodology
Author :
Shi, C. J Richard
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
fDate :
May 30 2010-June 2 2010
Abstract :
The verification of mixed-signal SoC is emerging as the most significant challenge, and with its cost surpassing the chip design cost. This paper presents a new automated verification methodology namely RVM (recursively verifying and modeling) and a set of supporting electronic design automation tools. The RVM methodology is built on the existing design flow and environments but with three major innovations to cope with custom-designed transistor blocks: a tool for automatically generating and validating simulation-efficiently behavioral models from a circuit netlist, a tool for characterizing and verifying the electrical rule correctness of analog blocks, and a hierarchical environment that allows designers to control the modeling and verification complexity. With the RVM methodology, analog circuits are verified in a way similar to the well-established digital verification. A set of industry benchmark results have shown that the RVM methodology is cable of reducing the verification time by potentially 100× to 1000×. With the increasing complexity of full-chip mixed-signal system-on-chip design, the RVM methodology is emerging as the only scalable verification solution.
Keywords :
circuit complexity; integrated circuit design; mixed analogue-digital integrated circuits; system-on-chip; RVM methodology; analog circuits; automated verification methodology; chip design cost; circuit netlist; custom-designed transistor; electronic design automation tools; full-chip mixed-signal system-on-chip design; mixed-signal SoC verification; mixed-signal system-on-chip verification; recursive verifying modeling methodology; simulation-efficiently behavioral model validation; verification complexity; Analog circuits; Automatic generation control; Character generation; Chip scale packaging; Circuit simulation; Costs; Electrical equipment industry; Electronic design automation and methodology; System-on-a-chip; Technological innovation;
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
DOI :
10.1109/ISCAS.2010.5537313