Title :
EMI associated with inter-board connection for module-on-backplane and stacked-card configurations
Author :
Ye, X. ; Nadolny, J. ; Drewniak, J.L. ; Hubing, T.H. ; Vaudoren, T.P. ; DuBroff, D.E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA
Abstract :
EMI associated with inter-board connection was studied through common-mode current measurements and FDTD modeling for stacked-card and module-on-backplane configurations. Three types of connections were investigated experimentally including an open pin field connection, an “ideal” semi-rigid coaxial cable connection, and a production connector. Both microstrip and stripline signal routing on the PCB were investigated. The results indicated signal routing on the PCBs or the inter-board connection can dominate the EMI process. Several cases of connector geometries were studied using FDTD modeling and good agreement was achieved between the measured and FDTD results
Keywords :
coaxial cables; electric connectors; finite difference time-domain analysis; microstrip lines; printed circuit accessories; printed circuit layout; radiofrequency interference; EMI associated; FDTD modeling; PCB; common-mode current measurements; connector geometries; inter-board connection; microstrip signal routing; module-on-backplane configuration; open pin field connection; production connector; semi-rigid coaxial cable connection; stacked-card configuration; stripline signal routing; Coaxial cables; Connectors; Current measurement; Electromagnetic interference; Finite difference methods; Microstrip; Production; Routing; Stripline; Time domain analysis;
Conference_Titel :
Electromagnetic Compatibility, 1999 IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-5057-X
DOI :
10.1109/ISEMC.1999.810121
