• DocumentCode
    3377816
  • Title

    A novel RFID tag chip with temperature sensor in standard CMOS process

  • Author

    Zhang, Qi ; Feng, Peng ; Zhou, Shenghua ; Geng, Zhiqing ; Wu, Nanjian

  • Author_Institution
    State Key Lab. for Superlattices & Microstructures, Chinese Acad. of Sci., Beijing, China
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    1109
  • Lastpage
    1112
  • Abstract
    This paper presents a novel RFID tag chip with temperature sensor in 0.18μm standard CMOS process. It consists of four blocks: RF/analog front-end circuit, 192-bit non-volatile memory (NVM), temperature sensor and digital baseband circuit. A CMOS UHF rectifier with dynamic bias using switch capacitor is proposed to improve the efficiency of rectification, while avoiding using costly Schottky diodes. We design a 192-bit NVM in standard CMOS process based on FN tunneling phenomenon with extremely small current density. It dissipates only 1.8μW/3.6μW for reading/writing operation. A 0.8μW smart temperature sensor with ±1°C resolution without power hungry ADCs is achieved. As a result, the power consumption is 5.8μW, 6.8μW, and 8.6μW for reading sensor, reading NVM and writing NVM respectively. The chip core area is 0.6mm2 in 0.18μm CMOS process.
  • Keywords
    CMOS integrated circuits; Schottky diodes; UHF circuits; analogue circuits; capacitors; digital circuits; intelligent sensors; radiofrequency identification; switches; temperature sensors; CMOS UHF rectifier; FN tunneling phenomenon; RF-analog front-end circuit; RFID tag chip; Schottky diodes; digital baseband circuit; nonvolatile memory; power 1.8 muW; power 3.6 muW; size 0.18 mum; smart temperature sensor; standard CMOS process; switch capacitor; word length 192 bit; Baseband; CMOS process; Circuits; Nonvolatile memory; RFID tags; Radio frequency; Rectifiers; Switches; Temperature sensors; Writing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537333
  • Filename
    5537333