• DocumentCode
    3377891
  • Title

    The multilevel fast multipole algorithm for electromagnetic compatibility analysis

  • Author

    Chao, Hsueh-Yung

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    844
  • Abstract
    This paper studies the application of the multilevel fast multipole algorithm (MLFMA) to the analysis of electromagnetic compatibility (EMC) problems. For structures composed of complex surfaces, wires, and interconnections of the latter, the MLFMA achieves the same accuracy as the classical method of moments, but requires far less simulation time and memory resources. In this paper, the MLFMA is used to predict the input impedance of a modules-on-backplane structure. Experimental results are used to validate the algorithm. Comparison with other numerical techniques (the classical method of moments, the finite element method, and the finite-difference time-domain method) shows that the MLFMA is the most effective technique in solving large-scale EMC problems
  • Keywords
    electric field integral equations; electromagnetic compatibility; interconnections; modules; wires (electric); EFIE; EMC analysis; FDTD; accuracy; complex surfaces; electric field integral equation; electromagnetic compatibility analysis; experimental results; finite element method; finite-difference time-domain method; input impedance prediction; interconnections; large-scale EMC problems; memory resources; method of moments; modules-on-backplane structure; multilevel fast multipole algorithm; numerical techniques; simulation time; wires; Algorithm design and analysis; Electromagnetic analysis; Electromagnetic compatibility; Finite difference methods; Finite element methods; MLFMA; Moment methods; Surface impedance; Time domain analysis; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1999 IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-5057-X
  • Type

    conf

  • DOI
    10.1109/ISEMC.1999.810130
  • Filename
    810130