• DocumentCode
    3378078
  • Title

    Temperature sensor placement in thermal management systems for MPSoCs

  • Author

    Zanini, Francesco ; Atienza, David ; Jones, Colin N. ; De Micheli, Giovanni

  • Author_Institution
    Lab. of Integrated Syst. (LSI), EPFL, Lausanne, Switzerland
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    1065
  • Lastpage
    1068
  • Abstract
    Modern high-performance processors employ thermal management systems, which rely on accurate readings of on-die thermal sensors. Systematic tools for analysis and determination of best allocation and placement of thermal sensors is therefore a highly relevant problem. This paper proposes a novel technique for determining the placement of temperature sensors on complex Multi-Processor Systems-on-Chips (MPSoCs) floorplans. The proposed method first analyzes the observability of the system for all the possible sensor placement configurations. Minimum sensors placements ensuring the observability of the portion of the MPSoC system that is relevant to the designer are then compared with simulation-based data coming from a wide set of benchmarks. Pareto points identifying the best configurations are than stored. According to user designer needs the best configuration is selected and a specific location is assigned to each sensor. We compared the proposed method with state-of-the-art approaches. Results show a reduction up to 4.5× in the number of required sensors.
  • Keywords
    multiprocessing systems; sensor placement; system-on-chip; temperature sensors; thermal analysis; thermal management (packaging); MPSoC system; Pareto points; high-performance processors; multiprocessor system-on-chips; on-die thermal sensors; simulation-based data; temperature sensor placement; thermal management systems; thermal sensor allocation; Frequency; Laboratories; Observability; Power system modeling; Sensor systems; Silicon; Sun; Temperature sensors; Thermal management; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537347
  • Filename
    5537347