DocumentCode
3378127
Title
Reliability aspects of defect analysis
Author
Bruls, E.M.J.G.
Author_Institution
Philips Res. Labs., Eindhoven, Netherlands
fYear
1993
fDate
19-22 Apr 1993
Firstpage
17
Lastpage
26
Abstract
Information about defects in the back-end of the production process of integrated circuits has been systematically gathered. This information is used to determine the various parameters of the defect and yield models. This paper shows that the number of defects which cause soft-faults and consequently may result in problems of reliability, is relatively high
Keywords
electronic engineering computing; integrated circuit testing; production testing; reliability; statistical analysis; IC production testing; VMX monitor; defect analysis; geometric deformations; production process; reliability; soft-faults; yield models; Circuit faults; Costs; Digital systems; Geometry; Integrated circuit modeling; Integrated circuit reliability; Laboratories; Production; Semiconductor device modeling; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
European Test Conference, 1993. Proceedings of ETC 93., Third
Conference_Location
Rotterdam
Print_ISBN
0-8186-3360-3
Type
conf
DOI
10.1109/ETC.1993.246537
Filename
246537
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