Title :
Proceedings of ETC 93. Third European Test Conference (Cat. No.93TH0494-5)
Abstract :
The following topics are dealt with: device and test program quality; system testability; mixed signal testing; delay fault testing; analog testing; memory testing; faults and defect coverage; testability design techniques; test pattern generation; fault simulation; testability analysis; test hardware; boundary scan; device testing; random test pattern techniques; test program development; signature analysis´; built-in self-test (BIST); and interconnect testing
Keywords :
analogue circuits; automatic test equipment; automatic testing; built-in self test; design for testability; fault location; integrated circuit testing; integrated logic circuits; integrated memory circuits; logic testing; mixed analogue-digital integrated circuits; production testing; random processes; ATE; BIST; IC testing; analog testing; boundary scan; built-in self-test; defect coverage; delay fault testing; fault simulation; interconnect testing; memory testing; mixed signal testing; production testing; random test pattern; signature analysis; test pattern generation; test program development; test program quality; testability analysis; testability design;
Conference_Titel :
European Test Conference, 1993. Proceedings of ETC 93., Third
Conference_Location :
Rotterdam, Netherlands
Print_ISBN :
0-8186-3360-3
DOI :
10.1109/ETC.1993.246540
