DocumentCode
3378224
Title
Diagonal MOSFETs characterization for 256M DRAM and beyond
Author
Hu, Yin ; Teng, Clarence W. ; Coleman, Donald J., Jr. ; Richardson, William F. ; Liu, Jiann ; Ho, Chi-Chien ; Aur, Shian
Author_Institution
Semicond. Process & Design Center, Texas Instrum. Inc., Dallas, TX, USA
fYear
1995
fDate
31 May-2 Jun 1995
Firstpage
309
Lastpage
313
Abstract
A diagonal MOSFET structure has been designed, fabricated and characterized for 256M DRAM and other general applications. The effective W/L ratio is found to play a very important role in diagonal MOSFET´s characteristics because of its three dimensional current flow pattern. In general, the diagonal MOSFETs have lower drive current but Vt is less sensitive to the scaling in device channel length and width. Our experimental results show that Channel Hot Carrier (CHC) degradation of diagonal MOSFETs is similar to that of conventional MOSFETs, despite the current crowding effect in the diagonal MOSFETs
Keywords
DRAM chips; MOS memory circuits; MOSFET; hot carriers; 256 Mbit; DRAMs; channel hot carrier degradation; current crowding; diagonal MOSFETs; drive current; three dimensional current flow; threshold voltage; width/length ratio; Capacitors; Degradation; Hot carriers; Instruments; MOSFETs; Proximity effect; Random access memory;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1995. Proceedings of Technical Papers. 1995 International Symposium on
Conference_Location
Taipei
ISSN
1524-766X
Print_ISBN
0-7803-2773-X
Type
conf
DOI
10.1109/VTSA.1995.524709
Filename
524709
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