Title :
Polymer Microchip for Electrophoresis-Mass Spectrometry Fabricated by Hot Embossing and Low Temperature Direct Bonding
Author :
Suzuki, T. ; Kitagawa, F. ; Shinohara, H. ; Mizuno, J. ; Otsuka, K. ; Shoji, S.
Author_Institution :
Waseda Univ., Tokyo
Abstract :
Integrated electrophoresis-mass spectrometry polymer devices were fabricated. The electrospray ionization (ESI) emitter tip structure was formed directly at the microchip electrophoresis (MCE) outlet. Since these devices enable negligible dead volume at the electrospray port, efficient spray of the sample necessary for high resolution mass spectrometry (MS) was realized. Stable spray was also achieved at the low flow rate (-0.1 muL/min) without additional pump. Low cost and high performance COP MCE-MS chip was fabricated by hot embossing and low temperature direct bonding.
Keywords :
bonding processes; electrophoresis; embossing; mass spectroscopy; polymers; sensors; electrophoresis-mass spectrometry; electrospray ionization emitter; hot embossing; low temperature direct bonding; microchip electrophoresis; polymer microchip; Bonding; Electrodes; Embossing; Gold; Ionization; Nanoscale devices; Plasma temperature; Polymers; Spectroscopy; Spraying; COP; Electrospray Ionization; Hot Embossing; Low Temperature Direct Bonding;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300458