Title :
11th IEEE workshop on signal propagation on interconnects
Abstract :
The following topics are dealt with: on-chip interconnects; transmission lines and high-speed channels; macromodeling by vector fitting; linear macromodeling; interconnect characterization; optical interconnects; 3D modeling; packaging and power integrity; interconnect modeling and analysis; chip, packaging and material issues.
Keywords :
curve fitting; electronics packaging; integrated circuit interconnections; integrated circuit modelling; optical interconnections; 3D modeling; high-speed channels; interconnect analysis; interconnect characterization; interconnect modeling; linear macromodeling; on-chip interconnects; optical interconnects; packaging; power integrity; transmission lines; vector fitting;
Conference_Titel :
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location :
Genova
Print_ISBN :
978-1-4244-1223-5
DOI :
10.1109/SPI.2007.4512189
