DocumentCode
3378424
Title
Analysis and Experimental Validation of Electromechanical Buckling
Author
Elata, D. ; Abu-Salih, S.
Author_Institution
Technion - Israel Inst. of Technol., Haifa
fYear
2007
fDate
10-14 June 2007
Firstpage
1669
Lastpage
1672
Abstract
We show that a symmetric electrostatic field can precipitately instigate buckling in a sub- critically loaded slender structure, and even instigate buckling when the slender structure is subjected to a tensile load. This work includes both theoretical analysis and experimental validation of electromechanical buckling. To this end, special microdevices where designed, fabricated and characterized. The significance of the work is that it generalizes the notion of mechanical buckling by considering the coupling of mechanical and electromechanical bifurcations.
Keywords
bifurcation; buckling; electric fields; electromechanical effects; electromechanical bifurcations; electromechanical buckling; microdevices; sub-critically loaded slender structure; symmetric electrostatic field; Bifurcation; Boundary conditions; Electrodes; Electrostatic actuators; Electrostatic analysis; Mechanical engineering; Micromechanical devices; Stability; Stators; Voltage; Electrostatic actuation; buckling; electromechanical instability;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location
Lyon
Print_ISBN
1-4244-0842-3
Electronic_ISBN
1-4244-0842-3
Type
conf
DOI
10.1109/SENSOR.2007.4300471
Filename
4300471
Link To Document