• DocumentCode
    3378431
  • Title

    Characterizing the lifetime reliability of manycore processors with core-level redundancy

  • Author

    Huang, Lin ; Xu, Qiang

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Hong Kong, China
  • fYear
    2010
  • fDate
    7-11 Nov. 2010
  • Firstpage
    680
  • Lastpage
    685
  • Abstract
    With aggressive technology scaling, integrated circuits suffer from ever-increasing wearout effects and their lifetime reliability has become a serious concern for the industry. For manycore processors that integrate a large number of processor cores on a single silicon die, introducing core-level redundancy is an effective way to alleviate this problem. There are, however, many strategies to make use of the redundant cores, which have different implications on the aging effects of embedded processors. How to characterize the lifetime reliability of manycore processors with different usages is therefore an important and relevant problem. In this paper, we propose a novel analytical method to tackle the above problem, which captures the impact of workloads and the associated temperature variations. We then use the proposed model to analyze the lifetime reliability for manycore processors with various redundancy configurations. Finally, the effectiveness of the proposed method is demonstrated with extensive experiments.
  • Keywords
    core levels; embedded systems; integrated circuit reliability; multiprocessing systems; redundancy; scaling circuits; aggressive technology scaling; aging effects; core level redundancy; embedded processors; integrated circuits; lifetime reliability; manycore processors; Analytical models; Integrated circuit modeling; Integrated circuit reliability; Program processors; Redundancy; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-8193-4
  • Type

    conf

  • DOI
    10.1109/ICCAD.2010.5654250
  • Filename
    5654250