Title :
Comparison between metallic carbon nanotube and copper future VLSI nano-interconnects
Author :
Maffucci, Antonio ; Miano, Giovanni ; Villone, Fabio
Author_Institution :
DAEIMI, Univ. di Cassino, Cassino
Abstract :
This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of metallic carbon nanotubes. A new model is presented to describe propagation along CNT bundles, in the framework of the classical transmission line theory. A possible future scaled CNT bundle microstrip is analyzed and compared to a conventional microstrip.
Keywords :
VLSI; carbon nanotubes; copper; nanoelectronics; CNT; VLSI nano-interconnects; copper; metallic carbon nanotube; nanometric dimensions; Atomic measurements; Carbon nanotubes; Copper; Current density; Electrodynamics; Electrons; Microstrip; Scattering; Thermal conductivity; Very large scale integration;
Conference_Titel :
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location :
Genova
Print_ISBN :
978-1-4244-1223-5
Electronic_ISBN :
978-1-4244-1224-2
DOI :
10.1109/SPI.2007.4512200
