DocumentCode
3378490
Title
Modularmultifunctional Siliconmicrosystems for Spacecraft Applications
Author
Köhler, J. ; Kratz, H. ; Nguyen, H. ; Thornell, G.
Author_Institution
Eur. Space Agency, Noordwijk
fYear
2007
fDate
10-14 June 2007
Firstpage
1673
Lastpage
1676
Abstract
This paper presents system engineering parameters obtained from experiments, design analyses, and modelling of multifunctional microsystem modules for future spacecraft, made from bonded silicon and glass wafers. Specifically, it is shown that the 68times68 mm, mass 54 g silicon modules in aluminium frames can be used as structural elements for spacecraft. Random vibration analysis implies that the modules can survive peak accelerations and shocks.
Keywords
aerospace instrumentation; aluminium; micromechanical devices; silicon; aluminium; modular multifunctional silicon microsystem; random vibration analysis; spacecraft application; Acceleration; Aerospace engineering; Aluminum; Design engineering; Glass; Semiconductor device modeling; Silicon; Space vehicles; Systems engineering and theory; Wafer bonding; FEM; MEMS; Signal modelling; Spacecraft; Structure; System engineering; Thermal control;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location
Lyon
Print_ISBN
1-4244-0842-3
Electronic_ISBN
1-4244-0842-3
Type
conf
DOI
10.1109/SENSOR.2007.4300472
Filename
4300472
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