DocumentCode :
3378688
Title :
Modular-addition signature analysis for built-in self-test
Author :
Wu, Cheng-Wen ; Chen, Hun-Song
Author_Institution :
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
1993
fDate :
19-22 Apr 1993
Firstpage :
457
Lastpage :
465
Abstract :
The conventional multiple input signature register (MISR) has an average time to alias of 2n (n is the length of the register), i.e., it aliasing probability is 1/2n. This paper presents a new cellular-automaton structure called modular-addition signature analyzer (MASA), which is shown to be an excellent alternative of MISR. It has a much lower hardware overhead than MISR based on equal aliasing probability. Experimental results show that, for n=16, MASA uses no more than 60% of the silicon area which MISR requires. The authors evaluate its ECs with respect to various error models, which shows consistently high ECs even for multiple errors. Its error coverages are easier to analyze than those of MISR. It can detect all single errors, multiple output stuck faults, and most of the unidirectional and bidirectional errors. In general, any error on a CUT output stream which makes the number of 1 s (modulo 4) being different from N (modulo 4) is detectable by MASA at a CUT output, where N is the correct number of 1 s at the CUT output stream
Keywords :
VLSI; built-in self test; error statistics; integrated logic circuits; logic analysers; logic testing; probability; MASA; aliasing probability; bidirectional errors; built-in self-test; cellular automata; cellular-automaton structure; error models; modular-addition signature analyzer; multiple output stuck faults; unidirectional errors; Built-in self-test; Circuit faults; Circuit simulation; Circuit testing; Computational modeling; Fault detection; Hardware; Silicon; Test pattern generators; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
European Test Conference, 1993. Proceedings of ETC 93., Third
Conference_Location :
Rotterdam
Print_ISBN :
0-8186-3360-3
Type :
conf
DOI :
10.1109/ETC.1993.246592
Filename :
246592
Link To Document :
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