DocumentCode
3378782
Title
Best Paper Award: The effect of a threshold failure time and bimodal behavior on the electromigration lifetime of copper interconnects
Author
Filippi, R.G. ; Wang, Pi-Chung ; Brendler, A. ; McLaughlin, P.S. ; Poulin, J. ; Redder, B. ; Lloyd, J.R. ; Demarest, J.J.
Author_Institution
IBM Systems and Technology Group, Hopewell Junction, NY, USA
fYear
2011
fDate
10-14 April 2011
Firstpage
1
Lastpage
3
Abstract
The award winners and the titles of their award winning papers are listed.
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location
Monterey, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-9113-1
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2011.5784438
Filename
5784438
Link To Document