Title :
Fundamentals of a 3-D “snowball” model for surface roughness power losses
Author :
Huray, P.G. ; Hall, Stephen ; Pytel, Steven ; Oluwafemi, Femi ; Mellitz, Richard ; Hua, Daniel ; Ye, Peng
Author_Institution :
Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC
Abstract :
SEM photographs of a typical copper conductors prepared by the PCB industry exhibit a 3-D "snowball" structure of copper surface distortions. We have developed an analytical basis for the electromagnetic scattering by the copper "snowballs" to predict additional power losses to those presented by the propagating medium that compare well with the observed measurements for a set of rough microstrip lines. In this paper we describe the fundamental concepts involved with the 3D scattering theory of our analysis.
Keywords :
conducting materials; copper; electromagnetic wave propagation; electromagnetic wave scattering; electronics industry; losses; microstrip lines; printed circuit manufacture; scanning electron microscopy; surface roughness; 3D snowball model fundamentals; PCB industry; SEM photographs; copper surface distortions; electromagnetic scattering; rough microstrip lines; surface roughness power losses; typical copper conductors preparation; Conductors; Copper; Distortion measurement; Electromagnetic analysis; Electromagnetic propagation; Electromagnetic scattering; Metals industry; Propagation losses; Rough surfaces; Surface roughness;
Conference_Titel :
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location :
Genova
Print_ISBN :
978-1-4244-1223-5
Electronic_ISBN :
978-1-4244-1224-2
DOI :
10.1109/SPI.2007.4512227
