• DocumentCode
    3379348
  • Title

    Translayer optimized co-design of in-space microwave based wireless power transfer

  • Author

    Bou, Elisenda ; Alarcón, Eduard ; Saenz-Otero, Alvar ; Mandy, Christopher

  • Author_Institution
    Electron. Eng. Dept., UPC BarcelonaTech, Barcelona, Spain
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    885
  • Lastpage
    888
  • Abstract
    In space applications, system designs involve a particularly thorough assessment of performance, reliability and stability, as failure cost increases very significantly at each design stage. This effort has to be stressed when evaluating the feasibility of an innovative concept such as an In-Space Wireless Power Transmission (WPT) link. In this context, this work addresses modelling/characterizing the relationships between the input design variables at subsystem level upon complete system-level performance metrics, thereby stablishing a translayer bridge between different system levels of a WPT link based on microwave RF power. The proposed design-oriented modelling framework allows to derive optimum design, which is of particular interest if a comparison of different alternative WPT methods is to be eventually addressed. The microwave WPT link is finally designed by solving the convex optimization problem of maximizing a set of target performance metrics compressed in a single merit figure, considering as the input design space the open design variables associated to the subsystem descriptions. The presented approach yields a design showing the feasibility of the WPT link with a required power of 100W from 0 to 100 meters with an efficiency range from 15% to 45%.
  • Keywords
    microwave power transmission; optimisation; WPT link; in-space microwave RF power; in-space wireless power transmission; optimization problem; Bridges; Context modeling; Costs; Design optimization; Measurement; Power system modeling; Power system reliability; Power transmission; Radio frequency; Stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537417
  • Filename
    5537417