DocumentCode
3379522
Title
Stacked capacitor cells for 64 MDRAM
Author
Matsukawa, Takayuki ; Nakano, Takao
Author_Institution
LSI Res. & Dev. Lab., Mitsubishi Electr. Corp., Hyogo, Japan
fYear
1991
fDate
22-24 May 1991
Firstpage
264
Lastpage
268
Abstract
Technological solutions to cope with the problem of how to adopt the stacked capacitor cell to 64 Mb DRAM and beyond are discussed. The stacked capacitor cell is the only candidate to realize beyond 64 Mb DRAM with economically reasonable cost
Keywords
DRAM chips; VLSI; cellular arrays; 64 Mbit; DRAM; cost; stacked capacitor cell; Capacitance; Capacitors; Cities and towns; Costs; Dielectric films; Etching; Large scale integration; Lithography; Random access memory; Research and development;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1991. Proceedings of Technical Papers, 1991 International Symposium on
Conference_Location
Taipei
ISSN
1524-766X
Print_ISBN
0-7803-0036-X
Type
conf
DOI
10.1109/VTSA.1991.246668
Filename
246668
Link To Document