Abstract :
The following topics were dealt with: MMIC; nanoelectronics; THz technology; reliability; IC layout; base station devices; handset technology; TR switches; phased arrays; GaN technology; CMOS mm-wave circuits; high-speed digital communication IC; X-band/broadband power amplifiers; high-speed mixed-mode IC; wireless communication; wired communication and HEMT technology.
Keywords :
CMOS integrated circuits; HEMT integrated circuits; III-V semiconductors; MMIC; gallium compounds; high-speed integrated circuits; integrated circuit layout; integrated circuit reliability; microwave power amplifiers; mixed analogue-digital integrated circuits; mobile handsets; nanoelectronics; submillimetre wave integrated circuits; switches; CMOS mm-wave circuits; GaN technology; HEMT technology; IC layout; MMIC; THz technology; TR switches; X-band power amplifiers; base station devices; broadband power amplifiers; handset technology; high-speed digital communication IC; high-speed mixed-mode IC; nanoelectronics; phased arrays; reliability; semiconductor integrated circuit; wired communication; wireless communication;
Conference_Titel :
Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-1939-5
DOI :
10.1109/CSICS.2008.1
