DocumentCode :
3379745
Title :
Implications of waveform and thickness dependence of SiO2 breakdown on accelerated testing
Author :
Rosenbaum, E. ; Moazzami, R. ; Hu, C.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
1991
fDate :
22-24 May 1991
Firstpage :
214
Lastpage :
218
Abstract :
Oxide breakdown characteristics under accelerated test conditions are different from those under normal operating conditions. While oxide lifetime under unipolar pulse stress is roughly equal to the DC lifetime multiplied by the reciprocal of the duty cycle, lifetime under bipolar pulse stress is extended by an additional factor of 40 or more. At the high electric fields used during accelerated testing, oxides with thickness greater than 15 nm suffer lifetime degradation which may be attributed to hole trapping. This will lead to overly conservative projections of lifetime under normal operating conditions
Keywords :
hole traps; impulse testing; insulating thin films; life testing; silicon compounds; DC lifetime; SiO2; accelerated test conditions; accelerated testing; bipolar pulse stress; duty cycle; hole trapping; lifetime degradation; operating conditions; oxide breakdown; oxide lifetime; thickness dependence; unipolar pulse stress; Breakdown voltage; Capacitors; Degradation; Dielectric breakdown; Electric breakdown; Life estimation; Life testing; Predictive models; Q measurement; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications, 1991. Proceedings of Technical Papers, 1991 International Symposium on
Conference_Location :
Taipei
ISSN :
1524-766X
Print_ISBN :
0-7803-0036-X
Type :
conf
DOI :
10.1109/VTSA.1991.246679
Filename :
246679
Link To Document :
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