Temperature and power measurement of modern dual core processor by infrared thermography

Author

Farkhani, F. Farrokhi ; Mohammadi, F.A.

Author_Institution

Dept. of Electr. & Comput. Eng., Ryerson Univ., Toronto, ON, Canada

fYear

2010

fDate

May 30 2010-June 2 2010

Firstpage

1603

Lastpage

1606

Abstract

An infrared (IR) thermography measurement setup to capture the temperature distribution and power dissipation of the device under test is proposed in this paper. The system is based on a transparent oil heatsink which captures the thermal profile and run-time power dissipation from the device under test with a very fine degree of granularity. The proposed setup is used to perform the thermal analysis and power dissipation measurement of an Intel Dual Core E2180 processor. In addition, a three-dimensional finite element thermal model of the processor is developed to simulate the thermal properties of the processor. The results obtained using simulation efforts are compared to the experimental results from IR thermography.

Keywords

finite element analysis; heat sinks; infrared imaging; microprocessor chips; power measurement; temperature distribution; temperature measurement; IR thermography measurement; Intel Dual Core E2180 processor; device under test; dual core processor; infrared thermography; power measurement; run-time power dissipation; temperature distribution; temperature measurement; thermal profile; thermal property; three-dimensional finite element thermal model; transparent oil heatsink; Finite element methods; Performance analysis; Performance evaluation; Petroleum; Power dissipation; Power measurement; Runtime; System testing; Temperature distribution; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on

Conference_Location

Paris

Print_ISBN

978-1-4244-5308-5

Electronic_ISBN

978-1-4244-5309-2

Type

conf

DOI

10.1109/ISCAS.2010.5537442

Filename

5537442