DocumentCode
3379892
Title
Measuring IC Layout Effects on Quality and Reliability
Author
Roesch, William J. ; Hamada, Dorothy June M
Author_Institution
TriQuint Semicond., Inc., Hillsboro, OR
fYear
2008
fDate
12-15 Oct. 2008
Firstpage
1
Lastpage
4
Abstract
Integrated Circuit designers are typically constrained by layout "rules" which can sometimes appear arbitrary. The layout rules are generally accepted as logical requirements for manufacturability. Deciding appropriate rules normally involves a combination of experiments and experiences. Process engineers typically have a very good understanding of the capability of their tools, and they will add margin to increase the manufacturability. This work provides data behind some specific layout rules in order to establish relationships between the design and important quality parameters such as yield & defect density.
Keywords
integrated circuit layout; integrated circuit manufacture; integrated circuit reliability; integrated circuit designers; integrated circuit layout effects; process engineers; Etching; Fabrication; Fingers; Gold; Integrated circuit interconnections; Integrated circuit layout; Lithography; Manufacturing processes; Resists; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
Conference_Location
Monterey, CA
ISSN
1550-8781
Print_ISBN
978-1-4244-1939-5
Electronic_ISBN
1550-8781
Type
conf
DOI
10.1109/CSICS.2008.16
Filename
4674471
Link To Document