• DocumentCode
    3379892
  • Title

    Measuring IC Layout Effects on Quality and Reliability

  • Author

    Roesch, William J. ; Hamada, Dorothy June M

  • Author_Institution
    TriQuint Semicond., Inc., Hillsboro, OR
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Integrated Circuit designers are typically constrained by layout "rules" which can sometimes appear arbitrary. The layout rules are generally accepted as logical requirements for manufacturability. Deciding appropriate rules normally involves a combination of experiments and experiences. Process engineers typically have a very good understanding of the capability of their tools, and they will add margin to increase the manufacturability. This work provides data behind some specific layout rules in order to establish relationships between the design and important quality parameters such as yield & defect density.
  • Keywords
    integrated circuit layout; integrated circuit manufacture; integrated circuit reliability; integrated circuit designers; integrated circuit layout effects; process engineers; Etching; Fabrication; Fingers; Gold; Integrated circuit interconnections; Integrated circuit layout; Lithography; Manufacturing processes; Resists; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
  • Conference_Location
    Monterey, CA
  • ISSN
    1550-8781
  • Print_ISBN
    978-1-4244-1939-5
  • Electronic_ISBN
    1550-8781
  • Type

    conf

  • DOI
    10.1109/CSICS.2008.16
  • Filename
    4674471