DocumentCode :
3379892
Title :
Measuring IC Layout Effects on Quality and Reliability
Author :
Roesch, William J. ; Hamada, Dorothy June M
Author_Institution :
TriQuint Semicond., Inc., Hillsboro, OR
fYear :
2008
fDate :
12-15 Oct. 2008
Firstpage :
1
Lastpage :
4
Abstract :
Integrated Circuit designers are typically constrained by layout "rules" which can sometimes appear arbitrary. The layout rules are generally accepted as logical requirements for manufacturability. Deciding appropriate rules normally involves a combination of experiments and experiences. Process engineers typically have a very good understanding of the capability of their tools, and they will add margin to increase the manufacturability. This work provides data behind some specific layout rules in order to establish relationships between the design and important quality parameters such as yield & defect density.
Keywords :
integrated circuit layout; integrated circuit manufacture; integrated circuit reliability; integrated circuit designers; integrated circuit layout effects; process engineers; Etching; Fabrication; Fingers; Gold; Integrated circuit interconnections; Integrated circuit layout; Lithography; Manufacturing processes; Resists; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
Conference_Location :
Monterey, CA
ISSN :
1550-8781
Print_ISBN :
978-1-4244-1939-5
Electronic_ISBN :
1550-8781
Type :
conf
DOI :
10.1109/CSICS.2008.16
Filename :
4674471
Link To Document :
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