DocumentCode
3380147
Title
A deep-submicrometer raised source/drain LDD structure fabricated using hot-wall epitaxy
Author
Moon, J.E. ; Galewski, C. ; Garfinkel, T. ; Wong, M. ; Oldham, W.G. ; Ko, P.K. ; Hu, C.
Author_Institution
Eastman Kodak Co., Rochester, NY, USA
fYear
1991
fDate
22-24 May 1991
Firstpage
117
Lastpage
121
Abstract
An elevated LDD (ELDD) structure has been designed, fabricated, and evaluated. A hot-wall reactor was used to selectively grow epitaxial silicon in the regions adjacent to the gate. The ELDD devices were equivalent to TOPS and LDD devices in current drive capability. The hot-electron reliability of the ELDD devices was superior to that of LDD devices. A general comparison among alternative LDD structures is given in terms of critical performance and reliability criteria. The ELDD structure is shown to be a promising candidate for deep-submicrometer applications
Keywords
VLSI; circuit reliability; hot carriers; integrated circuit technology; semiconductor growth; vapour phase epitaxial growth; Si epitaxy; VLSI; current drive capability; deep-submicrometer raised source/drain; elevated LDD structure; hot-electron reliability; hot-wall epitaxy; performance criteria; reliability criteria; selective growth; Circuits; Electrons; Epitaxial growth; Hot carrier effects; Hydrogen; Implants; Inductors; Moon; Silicon; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1991. Proceedings of Technical Papers, 1991 International Symposium on
Conference_Location
Taipei
ISSN
1524-766X
Print_ISBN
0-7803-0036-X
Type
conf
DOI
10.1109/VTSA.1991.246698
Filename
246698
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