Dry Filmpackage for Systemin Packagemolding Process

Author

Sondag-Huethorst, J.A.M. ; de Jager, S. ; de Nooijer, C. ; van Silfhout, R.B.R. ; van Kleef, M.H.

Author_Institution

Philips Appl. Technol., Eindhoven

fYear

2007

fDate

10-14 June 2007

Firstpage

2071

Lastpage

2074

Abstract

The stability of packages to protect a MEMS device against molding conditions is simulated and experimentally verified. A finite element method is used to predict the displacement of the cover of the package under influence of molding temperature and pressure. The model is verified using all organic packages of two different materials: ConforMask of Rohm-Haas and TMMF of Tokyo Ohka Kogyo Co. Ltd. The packages are made on wafer scale with a simple two layer dry film process. The process is inexpensive and compatible with CMOS processing. The experimental results were in good agreement with the modeling: the TMMF package (with relatively high Young modulus) withstands the molding pressure.

Keywords

Young´s modulus; finite element analysis; micromechanical devices; moulding; system-in-package; ConforMask; MEMS device; Rohm-Haas; TMMF; Tokyo Ohka Kogyo Co Ltd; Young modulus; dry film package; finite element method; package molding process; system-in-package; CMOS process; Finite element methods; Microelectromechanical devices; Organic materials; Packaging; Protection; Semiconductor device modeling; Stability; Temperature; Young´s modulus; Dry film package; MEMS; molding; system-in-package (SIP);

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International

Conference_Location

Lyon

Print_ISBN

1-4244-0842-3

Electronic_ISBN

1-4244-0842-3

Type

conf

DOI

10.1109/SENSOR.2007.4300572

Filename

4300572