Title :
CMOS-Compatible Wafer-Level Microdevice-Distribution Technology
Author :
Guerre, R. ; Drechsler, U. ; Jubin, D. ; Despont, M.
Author_Institution :
IBM Zurich Res. Lab., Zurich
Abstract :
We present a novel cost-efficient heterogeneous device integration method based on the distribution principle. This robust, CMOS back end of the line (BEOL) compatible, wafer-scale device- selective transfer method for the batch fabrication of Systems-On-Chip is especially suitable for MEMS and ICs. The strategy for device selectivity during bonding and debonding is presented, and the demonstration of the technology is accomplished using AFM cantilevers as test vehicle. We have successfully selected a fraction of AFM devices from a single high-device-density "source" wafer and distributed them to populate many lower-device-density "receiver" wafers.
Keywords :
CMOS integrated circuits; atomic force microscopy; micromechanical devices; system-on-chip; wafer-scale integration; AFM cantilevers; CMOS-compatible wafer-level microdevice-distribution technology; MEMS; back end of the line; batch fabrication; heterogeneous device integration method; high-device-density; systems-on-chip; wafer-scale device-selective transfer method; CMOS technology; AFM; Heterogeneous device integration; Systems-On-Chip; wafer-scale 3D integration;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300576
