Title :
Soft error testing at advanced technology nodes
Author :
Bhuva, B. ; Narasimham, B. ; Oates, A. ; Patterson, K. ; Tam, N. ; Vilchis, M. ; Wen, S.-J. ; Wong, R. ; Xu, Y.
Author_Institution :
Vanderbilt Univ., Nashville, TN, USA
Abstract :
A test vehicle concept for soft error testing of flip-flop designs has been developed and verified at 40 nm technology node. Key contribution of this test vehicle has been identification of any new unpredictable failure mechanisms, training of engineers for soft error testing and mitigation, establishment of knowledge database, and to build a start-to-finish (designers-foundry-system) link for a complete solution for soft error related issues. Major issues faced by the designers and test results are discussed for 40 nm technology node.
Keywords :
flip-chip devices; integrated circuit reliability; monolithic integrated circuits; advanced technology nodes; flip-flop designs; knowledge database; soft error testing; test vehicle concept; unpredictable failure mechanisms; Fabrication; Failure analysis; Flip-flops; IP networks; Integrated circuits; Neutrons; IC design; Soft errors; alpha particles; neutrons; testing;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-9113-1
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2011.5784519
