DocumentCode :
3380528
Title :
45-nm Planar bulk-CMOS 23-GHz LNAs with high-Q above-IC inductors
Author :
Wang, Wen-Chieh ; Huang, Zue-Der ; Carchon, Geert ; Mercha, Abdelkarim ; Decoutere, Stefaan ; De Raedt, Walter ; Wu, Chung-Yu
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear :
2010
fDate :
May 30 2010-June 2 2010
Firstpage :
741
Lastpage :
744
Abstract :
Two 23 GHz low-noise amplifier (LNA) have been designed and implemented by 45 nm planar bulk-CMOS technology with high-Q above-IC inductors. In the designed LNAs, the structure of cascode amplifier with source inductive degeneration is used. All high-Q above-IC inductors have been implemented by thin-film wafer-level packaging (WLP) technology. The fabricated one-stage LNA has a good linearity where the input 1 dB compression point (IP-1dB) is -9.5 dBm and the input referred third-order intercept point (PIIP3) is +2.25 dBm. It is operated with a 1 V power supply drawing a current of only 3.6 mA. The fabricated one-stage LNA has demonstrated a 4 dB noise figure (NF) and a 7.1 dB gain at the peak gain frequency of 23 GHz. Moreover, the fabricated two-stage LNA has the IP-1dB of -16 dBm and the PIIP3 of -4.2 dBm. It drains 9.3 mA from 1-V power supply. This two-stage LNA has demonstrated a 4.4 dB NF and a 11.6 dB gain at the peak gain frequency of 23.4 GHz. The fabricated one-stage LNA has the highest figure-of-merit (FOM). The experimental results have proved the suitability of 45 nm gate length planar bulk-CMOS devices for RF ICs above 20 GHz.
Keywords :
CMOS analogue integrated circuits; inductors; low noise amplifiers; radiofrequency integrated circuits; wafer level packaging; RFIC; WLP technology; cascode amplifier; current 3.6 mA; figure-of-merit; frequency 23 GHz; gain 11.6 dB; gain 7.1 dB; high-Q above-IC inductor; low-noise amplifier; noise figure 4 dB; planar bulk-CMOS LNA; size 45 nm; source inductive degeneration; thin-film wafer-level packaging; voltage 1 V; Current supplies; Frequency; Gain; Linearity; Low-noise amplifiers; Noise figure; Noise measurement; Power supplies; Thin film inductors; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
Type :
conf
DOI :
10.1109/ISCAS.2010.5537471
Filename :
5537471
Link To Document :
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