• DocumentCode
    3380613
  • Title

    C-Band GaN-HEMT Power Amplifier with Over 300-W Output Power and Over 50-% Efficiency

  • Author

    Shigematsu, H. ; Inoue, Y. ; Masuda, S. ; Yamada, M. ; Kanamura, M. ; Ohki, T. ; Makiyama, K. ; Okamoto, N. ; Imanishi, K. ; Kikkawa, T. ; Joshin, K. ; Hara, N.

  • Author_Institution
    Fujitsu Labs. Ltd., Atsugi
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we report a C-band power amplifier with over 300-W output power using 0.8-mum GaN-HEMTs. We used two-chip configuration and the three-stage impedance transformer to extend the bandwidth. The input and output lines adjacent to each chip are divided by four to suppress the non-uniform heat distribution in a chip at high frequencies. We confirmed that the uniform heat distribution in each chip under RF operation at 4.8 GHz. As a result, we obtained over 320-W output power and 57 % drain efficiency at 4.8 GHz. This is the highest output power of the one-package power amplifiers at C-band. We also obtained over 250-W output power and over 44-% drain efficiency between 4.7 GHz and 5.3 GHz.
  • Keywords
    III-V semiconductors; gallium compounds; high electron mobility transistors; impedance convertors; microwave power amplifiers; wide band gap semiconductors; C-band power amplifier; HEMT power amplifier; frequency 4.7 GHz to 5.3 GHz; heat distribution; microwave power amplifier; radiofrequency operation; size 0.8 mum; three-stage impedance transformer; two-chip configuration; Broadband amplifiers; Dielectric substrates; High power amplifiers; Impedance; Meteorological radar; Power amplifiers; Power generation; Q factor; Radiofrequency amplifiers; Spaceborne radar;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
  • Conference_Location
    Monterey, CA
  • ISSN
    1550-8781
  • Print_ISBN
    978-1-4244-1939-5
  • Electronic_ISBN
    1550-8781
  • Type

    conf

  • DOI
    10.1109/CSICS.2008.52
  • Filename
    4674507