DocumentCode :
3380847
Title :
A Single-Layer Step-Bridge for Out-Of-Plane Thermal Actuator
Author :
Yeh, Po-I ; Chen, Wen-Chih ; Hu, Chih-Fan ; Fang, Weileun
Author_Institution :
Nat. Tsing Hua Univ., Hsinchu
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
2175
Lastpage :
2178
Abstract :
This study presents the design and fabrication of a single-layer out-of-plane thermal actuator. The step-bridge structure design enables the actuator bent and then buckled in the out-of-plane direction by Joule-heating. In summary, the step-bridge actuator design has five merits: (l)The linear load-deflect ion relation is achieved, (2)The bi-stable buckling behavior is prevented, (3)The unwanted vibration modes can be suppressed, (4)The delamination problem is prevented, and (5)The bridge structure is stiffer and more stable. The actuator and its application on a lens positioning stage have been implemented using p++ Si layer by bulk micromachining.
Keywords :
microactuators; micromachining; Joule heating; bulk micromachining; out of plane; single layer; step bridge; thermal actuator; Bridge circuits; Delamination; Electrothermal effects; Fabrication; Hydraulic actuators; Micromechanical devices; Thermal conductivity; Thermal expansion; Thermal resistance; Vibrations; MEMS; out-of-plane; step-bridge; thermal actuator;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300598
Filename :
4300598
Link To Document :
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