• DocumentCode
    3380847
  • Title

    A Single-Layer Step-Bridge for Out-Of-Plane Thermal Actuator

  • Author

    Yeh, Po-I ; Chen, Wen-Chih ; Hu, Chih-Fan ; Fang, Weileun

  • Author_Institution
    Nat. Tsing Hua Univ., Hsinchu
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    2175
  • Lastpage
    2178
  • Abstract
    This study presents the design and fabrication of a single-layer out-of-plane thermal actuator. The step-bridge structure design enables the actuator bent and then buckled in the out-of-plane direction by Joule-heating. In summary, the step-bridge actuator design has five merits: (l)The linear load-deflect ion relation is achieved, (2)The bi-stable buckling behavior is prevented, (3)The unwanted vibration modes can be suppressed, (4)The delamination problem is prevented, and (5)The bridge structure is stiffer and more stable. The actuator and its application on a lens positioning stage have been implemented using p++ Si layer by bulk micromachining.
  • Keywords
    microactuators; micromachining; Joule heating; bulk micromachining; out of plane; single layer; step bridge; thermal actuator; Bridge circuits; Delamination; Electrothermal effects; Fabrication; Hydraulic actuators; Micromechanical devices; Thermal conductivity; Thermal expansion; Thermal resistance; Vibrations; MEMS; out-of-plane; step-bridge; thermal actuator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300598
  • Filename
    4300598