DocumentCode
3380847
Title
A Single-Layer Step-Bridge for Out-Of-Plane Thermal Actuator
Author
Yeh, Po-I ; Chen, Wen-Chih ; Hu, Chih-Fan ; Fang, Weileun
Author_Institution
Nat. Tsing Hua Univ., Hsinchu
fYear
2007
fDate
10-14 June 2007
Firstpage
2175
Lastpage
2178
Abstract
This study presents the design and fabrication of a single-layer out-of-plane thermal actuator. The step-bridge structure design enables the actuator bent and then buckled in the out-of-plane direction by Joule-heating. In summary, the step-bridge actuator design has five merits: (l)The linear load-deflect ion relation is achieved, (2)The bi-stable buckling behavior is prevented, (3)The unwanted vibration modes can be suppressed, (4)The delamination problem is prevented, and (5)The bridge structure is stiffer and more stable. The actuator and its application on a lens positioning stage have been implemented using p++ Si layer by bulk micromachining.
Keywords
microactuators; micromachining; Joule heating; bulk micromachining; out of plane; single layer; step bridge; thermal actuator; Bridge circuits; Delamination; Electrothermal effects; Fabrication; Hydraulic actuators; Micromechanical devices; Thermal conductivity; Thermal expansion; Thermal resistance; Vibrations; MEMS; out-of-plane; step-bridge; thermal actuator;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location
Lyon
Print_ISBN
1-4244-0842-3
Electronic_ISBN
1-4244-0842-3
Type
conf
DOI
10.1109/SENSOR.2007.4300598
Filename
4300598
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