DocumentCode
3380920
Title
LC: an integrated methodology to model and visualize the complex electrodynamics of 3D structures
Author
Gravrok, R. ; Piket-May, Melinda ; Thomas, K.
fYear
1995
fDate
2-4 Oct. 1995
Firstpage
74
Abstract
Equivalent-circuit models are obtained from direct interpretations of electromagnetic field data. Improved intuitive understanding is achieved with direct visualization of wave propagation through 3D structures. Applications to MCMs and power-distribution networks
Keywords
Data visualization; Electrodynamics; Electromagnetic fields; Inductance; Packaging; Power system modeling; Power system reliability; Prototypes; Pulse measurements; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR, USA
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524855
Filename
524855
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