Title :
High frequency characteristics of modular metric high-density connector systems
Author :
Wallenhorst, Ulrich ; Brenner, Achim
Author_Institution :
HARTING Ekektronik GmbH, Espelkamp, Germany
Abstract :
A signal integrity analysis of modular metric high-density connector systems for use in telecommunication, computer- and other high-speed applications is presented. Carefully designed appropriate high performance test-setups-with different contact-pitch-consisting of backplane and daughtercard are the basis for all time- and frequency-domain measurements like TDR/TDT, crosstalk, insertion loss, VSWR, and prop. delay. Based on 2-D FEM-calculations high-accuracy simulation-models are produced which include multiline-crosstalk. The calculated curves are in excellent agreement with the measured data. The behaviour in “bus-like” applications (connectors as a part of a stub) is discussed
Keywords :
S-parameters; SPICE; crosstalk; electric connectors; finite element analysis; high-frequency transmission line measurement; impedance matching; printed circuit accessories; printed circuit testing; time-domain reflectometry; 2D FEM-calculations; PCB test set-up; SPICE simulation; TDR/TDT; VSWR; backplane; bus-like applications; classical multiconductor theory; contact-pitch; crosstalk; daughtercard; frequency-domain measurements; high frequency characteristics; high-accuracy simulation-models; high-speed applications; insertion loss; modular metric high-density connector systems; multiline-crosstalk; signal integrity analysis; time-domain measurements; Application software; Backplanes; Connectors; Contacts; Frequency domain analysis; Frequency measurement; Performance loss; Signal analysis; Telecommunication computing; Testing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524856
