High frequency characteristics of modular metric high-density connector systems

Author

Wallenhorst, Ulrich ; Brenner, Achim

Author_Institution

HARTING Ekektronik GmbH, Espelkamp, Germany

fYear

1995

fDate

2-4 Oct 1995

Firstpage

77

Lastpage

83

Abstract

A signal integrity analysis of modular metric high-density connector systems for use in telecommunication, computer- and other high-speed applications is presented. Carefully designed appropriate high performance test-setups-with different contact-pitch-consisting of backplane and daughtercard are the basis for all time- and frequency-domain measurements like TDR/TDT, crosstalk, insertion loss, VSWR, and prop. delay. Based on 2-D FEM-calculations high-accuracy simulation-models are produced which include multiline-crosstalk. The calculated curves are in excellent agreement with the measured data. The behaviour in “bus-like” applications (connectors as a part of a stub) is discussed

Keywords

S-parameters; SPICE; crosstalk; electric connectors; finite element analysis; high-frequency transmission line measurement; impedance matching; printed circuit accessories; printed circuit testing; time-domain reflectometry; 2D FEM-calculations; PCB test set-up; SPICE simulation; TDR/TDT; VSWR; backplane; bus-like applications; classical multiconductor theory; contact-pitch; crosstalk; daughtercard; frequency-domain measurements; high frequency characteristics; high-accuracy simulation-models; high-speed applications; insertion loss; modular metric high-density connector systems; multiline-crosstalk; signal integrity analysis; time-domain measurements; Application software; Backplanes; Connectors; Contacts; Frequency domain analysis; Frequency measurement; Performance loss; Signal analysis; Telecommunication computing; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1995

Conference_Location

Portland, OR

Print_ISBN

0-7803-3034-X

Type

conf

DOI

10.1109/EPEP.1995.524856

Filename

524856