Title :
Test of 3D stacked microwave TR modules
Author_Institution :
Hughes Aircraft Co., Los Angeles, CA, USA
Abstract :
The performance of a three dimensional Transmit/Receive Module for a flat panel active array radar is reviewed. Solderless interconnects for both front and back side probing of the 3D Module are discussed as well as test results describing the performance of the module
Keywords :
active antenna arrays; antenna testing; heat sinks; modules; radar antennas; transceivers; 3D stacked microwave TR modules; back side probing; flat panel active array radar; front side probing; solderless interconnects; test results; transmit/receive module; Aircraft; Assembly; Circuit testing; Fixtures; Gallium arsenide; Integrated circuit interconnections; Performance evaluation; Radar; Radio frequency; Silicon;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524861
