DocumentCode
3381031
Title
Test of 3D stacked microwave TR modules
Author
Hauhe, Mark S.
Author_Institution
Hughes Aircraft Co., Los Angeles, CA, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
93
Lastpage
94
Abstract
The performance of a three dimensional Transmit/Receive Module for a flat panel active array radar is reviewed. Solderless interconnects for both front and back side probing of the 3D Module are discussed as well as test results describing the performance of the module
Keywords
active antenna arrays; antenna testing; heat sinks; modules; radar antennas; transceivers; 3D stacked microwave TR modules; back side probing; flat panel active array radar; front side probing; solderless interconnects; test results; transmit/receive module; Aircraft; Assembly; Circuit testing; Fixtures; Gallium arsenide; Integrated circuit interconnections; Performance evaluation; Radar; Radio frequency; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524861
Filename
524861
Link To Document