Title :
255 CBGA electrical performance comparison through package electrical characterization and system simulations
Author :
Osorio, Rolando ; Casto, Jim
Author_Institution :
Motorola Inc., Chandler, AZ, USA
Abstract :
The electrical performance of 255 CBGA packages from three suppliers are compared. This is done through the extraction of signal, power, and ground parasitic parameters such as resistance (R), self-inductance (L), mutual-inductance (M), and capacitance (C), and through SPICE system simulations. The results indicate that, although the three CBGAs´ electrical performances were different, they all performed satisfactorily at 100 MHz bus-frequency, for a 2.0 ns through 0.5 ns rise/fall time. A similar behavior in electrical performance was observed at other frequencies
Keywords :
SPICE; capacitance; circuit analysis computing; circuit noise; electric resistance; inductance; packaging; 0.5 to 2 ns; 100 MHz; 255 CBGA packages; 3D electromagnetic simulation; SPICE system simulations; bus-frequency; capacitance; ceramic ball grid array; electrical characterization; electrical performance comparison; fall time; ground bounce; mutual-inductance; parasitic parameters; power bounce; resistance; rise time; self-inductance; transmitted noise; Capacitance measurement; Conductivity; Data mining; Dielectric measurements; Electromagnetic measurements; Electromagnetic modeling; Packaging; Permeability; Power system modeling; SPICE;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524862
