Title :
A 5 mm ×5 mm ×1.37 mm hermetic FBAR duplexer for PCS handsets with wafer-scale packaging
Author :
Bradley, P.D. ; Ruby, R. ; Barfknecht, A. ; Geefay, F. ; Han, C. ; Gan, G. ; Oshmyansky, Y. ; Larson, J.D., III
Author_Institution :
Wireless Semicond. Div., Agilent Technol., Inc, Newark, CA, USA
Abstract :
We describe the design and measured performance of a 5 mm ×5 mm ×1.37 mm antenna duplexer for the U.S. PCS band (Tx: 1850-1910 MHz, Rx: 1930-1990 MHz) for cellular handsets based on FBAR (film acoustic resonator) technology. The FBARs are fabricated in a silicon-based IC process technology and are hermetically sealed in a wafer-level packaging process. Two dice, Tx and Rx, are attached to a 4-level printed circuit board, ball-bonded, and encapsulated in plastic to form the final product. Guaranteed worst-case Tx insertion loss is 3.5 dB, worst-case Rx insertion loss is 4.0 dB. Minimum rejection is 50/40 dB in the Tx/Rx bands, guaranteed isolation is >52/42 dB.
Keywords :
acoustic resonator filters; bulk acoustic wave devices; cellular radio; mobile handsets; plastic packaging; thin film devices; wafer-scale integration; 1.37 mm; 1850 to 1910 MHz; 1930 to 1990 MHz; 4-level printed circuit board; 5 mm; FBAR technology; PCS handsets; Rx insertion loss; Si-based IC process technology; Tx insertion loss; cellular handsets; film acoustic resonator; hermetic FBAR duplexer; plastic encapsulation; wafer-scale packaging; Acoustic measurements; Antenna measurements; Film bulk acoustic resonators; Hermetic seals; Insertion loss; Packaging; Personal communication networks; Printed circuits; Telephone sets; Wafer scale integration;
Conference_Titel :
Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE
Print_ISBN :
0-7803-7582-3
DOI :
10.1109/ULTSYM.2002.1193548