Title :
Crosstalk issues in flip chip multichip modules
Author :
Godshalk, Ed ; Bruns, Mike ; Ruttan, Tom
Author_Institution :
Tektronix Inc., Beaverton, OR, USA
Abstract :
A multilayer 2.5 Gbit/sec superconducting Multichip Module (MCM) has been modeled to investigate the feasibility of meeting specified performance goals. Due to the high speeds required flip chip bonding of the Josephson Junction Integrated Circuits (IC´s) is used. The MCM is comprised of both Polyimide (PI) dielectric and Mullite ceramic substrates, forming in effect an MCM-D/MCM-C hybrid structure. Niobium (Nb) low temperature superconductor (LTS) is used on the PI dielectric layers to form IC-data and IC-control nets that connect from chip to chip with transmission-line impedance of 2 and 8 ohms, respectively. In the Mullite layers, Tungsten (W) is used for clock, data in, data out, and control lines, all of 32 ohms, that connect from the IC´s to the MCM I/O ports
Keywords :
crosstalk; flip-chip devices; hybrid integrated circuits; integrated circuit modelling; integrated circuit noise; multichip modules; polymer films; superconducting device noise; superconducting integrated circuits; superconducting interconnections; 2.5 Gbit/s; Al2O3-SiO2; IC-control nets; Josephson junction integrated circuits; MCM I/O ports; MCM-D/MCM-C hybrid structure; Nb; Nb low temperature superconductor; W; chip to chip connection; crosstalk; flip chip bonding; flip chip multichip modules; ground bump bonds; high speed; mullite ceramic substrates; multilayer superconducting MCM; polyimide dielectric; transmission-line impedance; Bonding; Crosstalk; Dielectric substrates; Flip chip; High speed integrated circuits; Josephson junctions; Multichip modules; Niobium; Nonhomogeneous media; Superconducting integrated circuits;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524867
