• DocumentCode
    3381204
  • Title

    Ground path inductance characterization of a 225PBGA

  • Author

    Tsai, Chi-Taou

  • Author_Institution
    APDPC, Motorola Inc., Chandler, AZ, USA
  • fYear
    1995
  • fDate
    2-4 Oct 1995
  • Firstpage
    123
  • Lastpage
    125
  • Abstract
    This paper presents the measured L data of the ground (VSS ) structure of a 225PBGA by using a two-port network analyzer technique. The ground structure of this package has eight source points (bond wire sites) and one sink point (solder ball site). Measurement data is presented in terms of an 8×8 matrix for the VSS L path. Experimental procedure and its implications are discussed
  • Keywords
    CMOS integrated circuits; inductance; integrated circuit packaging; network analysers; soldering; two-port networks; 225PBGA; CMOS devices; IC packaging; bond wire sites; ground path inductance characterization; measured L data; sink point; solder ball site; source points; two-port network analyzer technique; Bonding; Electronic mail; Electronics packaging; Inductance; Lead; Power measurement; Scattering parameters; Semiconductor device measurement; Variable structure systems; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1995
  • Conference_Location
    Portland, OR
  • Print_ISBN
    0-7803-3034-X
  • Type

    conf

  • DOI
    10.1109/EPEP.1995.524870
  • Filename
    524870
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3381204