Title :
Ground path inductance characterization of a 225PBGA
Author_Institution :
APDPC, Motorola Inc., Chandler, AZ, USA
Abstract :
This paper presents the measured L data of the ground (VSS ) structure of a 225PBGA by using a two-port network analyzer technique. The ground structure of this package has eight source points (bond wire sites) and one sink point (solder ball site). Measurement data is presented in terms of an 8×8 matrix for the VSS L path. Experimental procedure and its implications are discussed
Keywords :
CMOS integrated circuits; inductance; integrated circuit packaging; network analysers; soldering; two-port networks; 225PBGA; CMOS devices; IC packaging; bond wire sites; ground path inductance characterization; measured L data; sink point; solder ball site; source points; two-port network analyzer technique; Bonding; Electronic mail; Electronics packaging; Inductance; Lead; Power measurement; Scattering parameters; Semiconductor device measurement; Variable structure systems; Wire;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524870
