Title :
Thermal Analysis of Printed Circuit Board Due to Thermal Stress By Using Thermography and Holography
Author :
Netsu, Takonori ; Taniguchi, Massanari ; Ishida, Hiroyuki ; Yanada, Toshiaki ; Takagi, Tasuku
Author_Institution :
Fac. of Sci. & Technol., Tohoku Bunka Gakuen Univ., Sendai
Abstract :
By using both FEMLAB simulator and the Thermography, the thermal pattern was analyzed of printed circuit board deformed due to thermal stress. And, the deformation pattern was measured by using the holographic pattern measuring system (HPMS). As the results, both thermal pattern and deformation pattern were observed as a different pattern each other. And, we found that the HPMS could be effectively used as a tool for analyzing PCB deformation with 3-D graphic image
Keywords :
holography; infrared imaging; printed circuits; thermal analysis; thermal stresses; 3D graphic image; FEMLAB simulator; holographic pattern measuring system; holography; printed circuit board; thermal analysis; thermal stress; thermography; Analytical models; Circuit analysis; Circuit simulation; Deformable models; Graphics; Holography; Image analysis; Pattern analysis; Printed circuits; Thermal stresses; Deformation analysis; Holography; Printed circuit board; Thermal stress; Thermography;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2005. IMTC 2005. Proceedings of the IEEE
Conference_Location :
Ottawa, Ont.
Print_ISBN :
0-7803-8879-8
DOI :
10.1109/IMTC.2005.1604515
