DocumentCode :
3381343
Title :
FREQUENCY DOMAIN MEASUREMENTS OF VSPA: A NOVEL PACKAGING TECHNOLOGY
Author :
Hao, J. ; Richter, A. ; Laskar, J. ; Swaminathan, M. ; Mosley, J.
fYear :
1995
fDate :
2-4 Oct 1995
Firstpage :
134
Keywords :
Costs; Electronics packaging; Frequency domain analysis; Frequency measurement; Inductance; Integrated circuit packaging; Pins; Plastic packaging; Space heating; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Print_ISBN :
0-7803-3034-X
Type :
conf
DOI :
10.1109/EPEP.1995.524875
Filename :
524875
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3381343
