DocumentCode
3381454
Title
Microwave packages for 30 Gbit/s analog and digital circuits
Author
Petersen, A.K. ; Yu, R. ; Runge, K. ; Bowers, J.E. ; Wang, K.C.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
152
Lastpage
154
Abstract
In this paper microwave packages for very high speed analog and digital circuits are described. The microwave packages have excellent performance up to 40 GHz. Use of these packages is demonstrated with a 30 Gbit/s 4:1 multiplexer and a DC-26 GHz baseband AGC amplifier
Keywords
MMIC; digital integrated circuits; integrated circuit packaging; 0 to 40 GHz; 30 Gbit/s; baseband AGC amplifier; high speed analog circuits; high speed digital circuits; microwave packages; multiplexer; Connectors; Coplanar waveguides; Dielectric losses; Digital circuits; Electronics packaging; Frequency; Insertion loss; Loss measurement; Propagation losses; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524880
Filename
524880
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