Title :
Microwave packages for 30 Gbit/s analog and digital circuits
Author :
Petersen, A.K. ; Yu, R. ; Runge, K. ; Bowers, J.E. ; Wang, K.C.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
In this paper microwave packages for very high speed analog and digital circuits are described. The microwave packages have excellent performance up to 40 GHz. Use of these packages is demonstrated with a 30 Gbit/s 4:1 multiplexer and a DC-26 GHz baseband AGC amplifier
Keywords :
MMIC; digital integrated circuits; integrated circuit packaging; 0 to 40 GHz; 30 Gbit/s; baseband AGC amplifier; high speed analog circuits; high speed digital circuits; microwave packages; multiplexer; Connectors; Coplanar waveguides; Dielectric losses; Digital circuits; Electronics packaging; Frequency; Insertion loss; Loss measurement; Propagation losses; Resonance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524880
