DocumentCode
3381482
Title
Measurement based characterization of RF-IC packages
Author
Kollipara, R.T. ; Tripathi, A. ; Williams, J. ; Tripathi, V.K.
Author_Institution
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
163
Lastpage
165
Abstract
Low cost and small lead frame packages are characterized for RF wireless applications in terms of self and mutual inductances and capacitances associated with the package pins. A multiport measurement scheme to extract these self and mutual element values is presented together with examples of typical low cost RF-IC packages
Keywords
capacitance measurement; inductance measurement; integrated circuit measurement; integrated circuit packaging; multiport networks; RF-IC packages; capacitance; lead frame; multiport measurement; mutual inductance; self inductance; wireless; Capacitance; Costs; Couplings; Electromagnetic measurements; Fixtures; Integrated circuit packaging; Measurement techniques; Pins; Radio frequency; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524883
Filename
524883
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