Coplanar bond wire interconnections for millimeter-wave applications

Author

Krems, Tobias ; Haydl, W. ; Verweyen, L. ; Schlechtweg, M. ; Massler, Hermann ; Rudiger, J.

Author_Institution

Fraunhofer Inst. for Appl. Solid State Phys., Freiburg, Germany

fYear

1995

fDate

2-4 Oct 1995

Firstpage

178

Lastpage

180

Abstract

An investigation of bond wire interconnections for coplanar integrated millimeter-wave circuits is presented. Assuming a transmission line behaviour of the bond wire its characteristic impedance and propagation constant are calculated using two dimensional finite element simulations. The model is validated by comparison with experimental data and then used to estimate the maximum length for bond wires in millimeter-wave applications. Bond wire matching networks are introduced giving a broadband improvement in the behaviour of interconnections with long wires

Keywords

finite element analysis; integrated circuit interconnections; lead bonding; millimetre wave integrated circuits; characteristic impedance; coplanar bond wire interconnections; matching networks; millimeter-wave integrated circuits; propagation constant; transmission line; two dimensional finite element simulation; Bonding; Coplanar transmission lines; Distributed parameter circuits; Impedance; Integrated circuit interconnections; Millimeter wave circuits; Millimeter wave integrated circuits; Millimeter wave propagation; Propagation constant; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1995

Conference_Location

Portland, OR

Print_ISBN

0-7803-3034-X

Type

conf

DOI

10.1109/EPEP.1995.524887

Filename

524887