Low cost, highly integrated MMW MMIC transceiver packages

Author

Gawrouski, M. ; Seashore, C. ; Bosch, D. ; Lamberg, J. ; Loughran, S. ; Rabel, J.

Author_Institution

Div. of Defense Syst., Alliant Techsystems, Hopkins, MN, USA

fYear

1995

fDate

2-4 Oct 1995

Firstpage

183

Abstract

Summary form only given, as follows. A producible, high density Ka-Band (35 GHz) monolithic transceiver package has been developed containing a full set of MMIC transmit/receive chips. This paper presents the results of extensive 3-D electromagnetic high frequency chip-to-chip and chip-to-microstrip line/packaging interconnect analyses. The MMIC module includes a novel chip-on-carrier design with a low cost “Duroid” soft substrate performing the RF circuit interconnection with IF amplification

Keywords

MIMIC; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; microstrip lines; transceivers; 35 GHz; Duroid; IC packages; IF amplification; Ka-Band; MMW MMIC transceiver; RF circuit interconnection; chip-on-carrier design; chip-to-chip/packaging interconnect; chip-to-microstrip line/packaging interconnect; soft substrate; transmit/receive chips; Costs; Electromagnetic analysis; Electronics packaging; Frequency; Integrated circuit interconnections; MMICs; Manufacturing; Societies; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1995

Conference_Location

Portland, OR

Print_ISBN

0-7803-3034-X

Type

conf

DOI

10.1109/EPEP.1995.524889

Filename

524889