Title :
Low cost, highly integrated MMW MMIC transceiver packages
Author :
Gawrouski, M. ; Seashore, C. ; Bosch, D. ; Lamberg, J. ; Loughran, S. ; Rabel, J.
Author_Institution :
Div. of Defense Syst., Alliant Techsystems, Hopkins, MN, USA
Abstract :
Summary form only given, as follows. A producible, high density Ka-Band (35 GHz) monolithic transceiver package has been developed containing a full set of MMIC transmit/receive chips. This paper presents the results of extensive 3-D electromagnetic high frequency chip-to-chip and chip-to-microstrip line/packaging interconnect analyses. The MMIC module includes a novel chip-on-carrier design with a low cost “Duroid” soft substrate performing the RF circuit interconnection with IF amplification
Keywords :
MIMIC; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; microstrip lines; transceivers; 35 GHz; Duroid; IC packages; IF amplification; Ka-Band; MMW MMIC transceiver; RF circuit interconnection; chip-on-carrier design; chip-to-chip/packaging interconnect; chip-to-microstrip line/packaging interconnect; soft substrate; transmit/receive chips; Costs; Electromagnetic analysis; Electronics packaging; Frequency; Integrated circuit interconnections; MMICs; Manufacturing; Societies; Transceivers;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524889
