Title :
Recent progress in the simulation of high speed VLSI interconnects
Author :
Nakhla, Michel ; Chiprout, Eli ; Acha, Ramachandra ; Khazaka, Roni
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Abstract :
This paper presents an overview of recent progress in the simulation and modeling of VLSI interconnects using moment matching techniques which provide a speed-up of 1-3 orders of magnitude over conventional methods. Interconnects are modeled as lossy coupled transmission lines with frequency dependent parameters
Keywords :
VLSI; circuit analysis computing; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; method of moments; VLSI interconnects; frequency dependent parameters; high speed VLSI; lossy coupled transmission lines; modeling; moment matching techniques; simulation; Circuit simulation; Coupling circuits; Crosstalk; Delay effects; Delay estimation; Frequency; Integrated circuit interconnections; Propagation losses; Switching circuits; Very large scale integration;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524892
