• DocumentCode
    3381633
  • Title

    Research on electromechanical model of micro-accelerometer based on SOI technology

  • Author

    Qian, Keqiang ; Luo, Wen ; Yu, Qi

  • Author_Institution
    State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    433
  • Lastpage
    436
  • Abstract
    To cope with the imprecise model of electro-mechanical integration simulation and complex process of parameter extraction, a Simulink model of micro-accelerometer based on SOI technology is proposed in this paper. The model realizes the very closely results between the simulation without device-level circuits and Coventor Ware simulation. Compared with the results of experimental test, the error of voltage sensitivity is less than 2%, the error of differential capacitance sensitivity is less than 8%, and acceleration bias is less than 10%. So the model can realize the simulation of electro-mechanical integration and be helpful in fast optimization of the parameter of structure and circuits, and the model has better reference function to the research of MEMS inertial device.
  • Keywords
    accelerometers; micromechanical devices; silicon-on-insulator; CoventorWare simulation; MEMS inertial device; SOI technology; Simulink model; acceleration bias; complex process; device-level circuits; differential capacitance sensitivity; electro-mechanical integration simulation; electromechanical model; imprecise model; micro-accelerometer; parameter extraction; reference function; voltage sensitivity error; Acceleration; Equations; Silicon; Switches; Electromechanical Integration; SOI; micro-accelerometer; switched-capacitor amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2011 IEEE 9th International Conference on
  • Conference_Location
    Xiamen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-61284-192-2
  • Electronic_ISBN
    2162-7541
  • Type

    conf

  • DOI
    10.1109/ASICON.2011.6157214
  • Filename
    6157214