Title :
Efficient 3-D series impedance extraction using effective internal impedance
Author :
Lee, Beom-Taek ; Tuncer, Emre ; Neikirk, Dean P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Abstract :
The effective internal impedance approach, combined with the current-filament technique, has been shown to be a very efficient way to extract frequency dependent resistance and inductance of uniform interconnects. In this study, we show that this approach can be extended to find the series impedance of three dimensional structures. A microstrip bend is studied as a simple example
Keywords :
electric impedance; microstrip discontinuities; waveguide discontinuities; 3D series impedance; current-filament technique; effective internal impedance; frequency dependent resistance; inductance; interconnects; microstrip bend; three dimensional structures; Conductors; Conformal mapping; Finite difference methods; Frequency dependence; Inductance; Integrated circuit interconnections; Packaging; Skin; Surface impedance; Surface resistance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524899
