• DocumentCode
    338203
  • Title

    Acoustic resonance tracking in sol gel materials

  • Author

    Serfaty, S. ; Griesmar, P. ; Gindre, M. ; Gouédard, G. ; Figuiére, P.

  • Author_Institution
    Univ. de Cergy-Pontoise, France
  • Volume
    2
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    1171
  • Abstract
    The sol-gel synthesis of glasses and ceramics has received a great amount of scientific and technological interest. The close control of its evolution between the sol and gel states allows the elaboration of highly appropriate materials for technical purposes. The sol-gel transition can be characterized by a very rapid increase of the bulk viscosity of the medium. This paper presents a non-invasive technique of investigation based on acoustic resonance, which can trace the sol-gel evolution. Two different sol-gel matrices have been prepared from silica gels using acid and basic agents. The study of the evolution of these sol-gel matrices shows that in the gel phase, several resonance frequencies appear and increase as a function of time. In both matrices the evolution of these resonance frequencies follow an exponential law according to percolation models for a cross-linked polymeric network. In addition, this technique is particularly well suited to investigate the SG matrices with short gelation times
  • Keywords
    acoustic resonance; ceramics; glass; percolation; sol-gel processing; viscosity; SiO2; acoustic resonance tracking; bulk viscosity; ceramics; cross-linked polymeric network; exponential law; gel phase; glasses; noninvasive technique; percolation models; resonance frequencies; short gelation time; silica gels; sol gel materials; sol-gel evolution; sol-gel synthesis; sol-gel transition; Acoustic materials; Ceramics; Glass; Resonance; Resonant frequency; Silicon compounds; Strain measurement; Stress measurement; Ultrasonic variables measurement; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1998. Proceedings., 1998 IEEE
  • Conference_Location
    Sendai
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-4095-7
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1998.765047
  • Filename
    765047