DocumentCode
3382075
Title
On-Chip High Quality Factor CMOS-MEMS Silicon-Fin Resonators
Author
Lo, Chiung-C ; Fedder, Gary K.
Author_Institution
Carnegie Mellon Univ., Pittsburgh
fYear
2007
fDate
10-14 June 2007
Firstpage
2449
Lastpage
2452
Abstract
An in-plane CMOS-MEMS fully differential silicon-fin resonator (SiFR), operating as a cantilever beam at free-clamp mode with a center frequency of 8.04 MHz, quality factor (Q) of 3589, and insertion loss of 33.6 dB is introduced. The resonator was fabricated directly on a conventional CMOS substrate with an on-chip differential amplifier. To enhance the Q, a 2-step silicon etch is employed to harness the high material Q of silicon substrate resulting in more than three times Q enhancement than that of previous CMOS-MEMS resonators.
Keywords
CMOS integrated circuits; Q-factor; differential amplifiers; silicon; CMOS MEMS resonator; CMOS substrate; cantilever beam; differential amplifier; loss 33.6 dB; on-chip high quality factor; silicon-fin resonator; Capacitance; Differential amplifiers; Electrodes; Insertion loss; Microcavities; Q factor; Resonant frequency; Silicon; Structural beams; Voltage; CMOS-MEMS; RF MEMS; high Q; silicon resonator;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location
Lyon
Print_ISBN
1-4244-0842-3
Electronic_ISBN
1-4244-0842-3
Type
conf
DOI
10.1109/SENSOR.2007.4300666
Filename
4300666
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