Title :
C-mode imaging of reflection ratio on curved surface of bone
Author :
Ishii, T. ; Nakamori, Y. ; Kanai, H. ; Chubachi, N.
Author_Institution :
Res. Inst., Sekisui Chem. Co. Ltd., Tsukuba, Japan
Abstract :
An ultrasonic-based method has been proposed for measuring the spatial distribution of reflection ratio on the curved surface of a bone object. This method, employing a two dimensional transducer array, is based on the time reversible symmetry of wave propagation. A scattering matrix is defined for each scatter object from each combination of two transducers in the transducer array. By solving the eigenvalue problem based on the scattering matrix, the reflection ratio on the curved surface of each scatter object is derived. The largest eigenvalue of the scattering matrix corresponds to the reflection ratio when the incident angle of the ultrasound is normal to the object surface. At the same time, the eigenvector corresponds to the signal supplied to transducers which makes the wave front along the curved surface. In the simulation and experiments, the transducers array is 8 by 8 two dimensional transducers. From a theoretical viewpoint and experiments, we conclude that this new method is useful to measure the acoustic impedance of objects with curved surfaces such as spine bones or femurs
Keywords :
biomedical ultrasonics; bone; eigenvalues and eigenfunctions; medical image processing; ultrasonic propagation; ultrasonic reflection; ultrasonic transducer arrays; C-mode imaging; acoustic impedance; bone object; curved surface; eigenvalue problem; eigenvector; femurs; incident angle; object surface; reflection ratio; scatter object; scattering matrix; spatial distribution; spine bones; time reversible symmetry; two dimensional transducer array; ultrasonic-based method; wave front; wave propagation; Acoustic measurements; Acoustic scattering; Acoustic transducers; Bones; Eigenvalues and eigenfunctions; Reflection; Surface acoustic waves; Ultrasonic imaging; Ultrasonic transducers; Ultrasonic variables measurement;
Conference_Titel :
Ultrasonics Symposium, 1998. Proceedings., 1998 IEEE
Conference_Location :
Sendai
Print_ISBN :
0-7803-4095-7
DOI :
10.1109/ULTSYM.1998.765182