Title :
Intra-IC Inspection and Metrology with Picosecond Laser Ultrasonics
Author :
Andriamonje, G. ; Pouget, V. ; Ousten, Y. ; Lewis, D. ; Fouillat, P. ; Danto, Y.
Author_Institution :
UMR CNRS, Univ. Bordeaux, Talence
Abstract :
This paper presents the application of picosecond laser ultrasonics for integrated circuit inspection and failure analysis. The technique is described and illustrated with several results. The potential for metal and inter-metal layers metrology in the context of process characterization is illustrated
Keywords :
failure analysis; inspection; integrated circuit measurement; integrated circuit testing; measurement by laser beam; ultrasonic measurement; failure analysis; integrated circuit inspection; inter-metal layers metrology; intra-IC inspection; metal layers metrology; picosecond laser ultrasonics; process characterization; Acoustic pulses; Acoustic waves; Failure analysis; Inspection; Laser excitation; Metrology; Optical pulses; Optical pumping; Pulse measurements; Pump lasers; integrated circuits failure analysis; picosecond ultrasonics; pump-probe laser interferometry; thin film metrology;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2005. IMTC 2005. Proceedings of the IEEE
Conference_Location :
Ottawa, Ont.
Print_ISBN :
0-7803-8879-8
DOI :
10.1109/IMTC.2005.1604575
